Antropy will conclude a merit invitation for an independent, co-location alliance with The Jack Baskin School of Engineering at the University of California. This 200 mm semiconductor fabrication facility is equipped with the most advanced class 100 clean room optical assembly space and unlimited access to the most advanced testing and measuring equipment, including a scanning electron microscope. The facility was donated by Texas Instruments to The Baskin School, to be used for advanced thin film technology development. Antropy is the first thin film technology company to join the partnership. This facility, overlooking Natural Bridges State Park and the Pacific Ocean, provides an appropriate and prestigious showcase for Antropy products and technologies.
Phoenix Wide Area Production Tool developed by Dr. Demaray. These physical vapor deposition cluster tools are currently and successfully used in TFT-LCD (transistor liquid crystal display) and new solid-state Li+ ion battery manufacturing.
Proven and patented photonic technology is advanced with new patents for product design and manufacture. The Antropy team will utilize its existing wide area thin film manufacturing tools derived from TFT-LCD manufacturing and adapted to optical processes, for high volume and low cost manufacturing. These technologies and processes have been thoroughly tested and proven. Antropy brings extensive product development and manufacturing setup talent, and is sized with existing manufacturing equipment and a state-of-the-art manufacturing facility to meet productions demands of a premium margin business.
Wide Area Vacuum Optical Film Equipment 450 x 650 mm.
Antropy uses proprietary, high speed, and high quality thin film deposition manufacturing processes and equipment. ApCC die are manufactured using Antropy’s patented 200mm physical vapor deposition equipment with patented processes that are fully automated for high capacity and high yield, resulting in low cost of goods. Standard, readily available, silicon, quartz and sapphire wafers are used.